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'China Unveils 3D Heterogeneous Integration Chip To Challenge Nvidia's 4nm AI Computing Power' - DigiTimes Alert
At the ICC Global CEO Summit, Professor Wei Shaojun revealed China's breakthrough in AI computing using 14/18nm 3D stacked chips with heterogeneous integration technology. This innovation aims to overcome reliance on Nvidia's ecosystem and US restrictions by achieving performance comparable to Nvidia's 4nm GPUs.
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