• More than $10 billion in investments across the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging capabilities for AI infrastructure
  • Industry-leading EFB-based 2.5D packaging to enable higher interconnect bandwidth and efficiency in 6th Gen AMD EPYC CPUs, codenamed "Venice"
  • AMD Helios rack-scale platform with "Venice" and AMD Instinct MI450X GPUs on track for multi-gigawatt deployments beginning 2H 2026