Qnity Electronics, Inc. ("Qnity") (NYSE:Q), a premier technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP).

 

A scientist evaluates the performance of Stackplane™ CMP slurry in Qnity's polishing lab in Hsinchu, Taiwan. Qnity's Stackplane™ CMP slurries are designed for the unique CMP complexities of advanced packaging applications.

Stackplane™ slurries support the industry's move toward shrink and stack, where continued transistor scaling is paired with the stacking and integration of multiple chips to deliver the bandwidth and density that AI and high-performance computing need. Many advanced packaging programs require numerous distinct CMP steps, including planarization following hybrid bonding and through-silicon via (TSV) integration. The Stackplane™ product family brings together a comprehensive slurry portfolio to address the varied requirements of these critical CMP processes.