The contract establishes a framework for Trinovium and RTI to develop and deploy direct-to-chip liquid cooling solutions for artificial intelligence ("AI"), high-performance computing ("HPC") and modular data center applications. A key element of the collaboration is RTI’s commitment to become a commercial pilot customer for Trinovium’s cooling fluids and analytical systems, including paid product supply as part of the pilot deployment.

The agreement is expected to provide Trinovium with real-world operating data and customer feedback to support product validation, refinement and broader commercialization. The collaboration will combine RTI’s cooling-system expertise, modular data center capabilities and deployment experience with Trinovium’s expertise in fluid science, analytical technologies, high-specification manufacturing and quality systems. Trinovium and RTI expect to focus initially on integration planning, product testing, pilot deployment followed by the collection of operational performance data and evaluation of product improvements, scale-up requirements and potential broader commercial opportunities.