Expanded partnership spans TSMC A14 certification, silicon-proven IP on TSMC N3P/N2P, wafer-scale 3D-IC for hundreds of chiplets, and agentic AI flows

Cadence (NASDAQ:CDNS) today announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers. Cadence has achieved tool certification for TSMC’s advanced A14 process, demonstrated an industry-leading UALink solution in TSMC N3P, and introduced new silicon-proven IP for N3P and N2P technologies. Through this partnership, the companies are enabling agentic AI chip and 3D-IC design flows across TSMC's N3, N2, A16™ and A14 process technologies, including TSMC 3DFabric® support for wafer-scale systems with hundreds of chiplets.