• Qualcomm collaborating with Amazon across multiple generations of customized silicon to support AWS's growing AI infrastructure.



     
  • Qualcomm advanced optical connectivity solutions will support high-bandwidth interconnects within Amazon data center networks.

SAN DIEGO, Sept. 8, 2026 /PRNewswire/ -- Qualcomm Technologies, Inc. (NASDAQ:QCOM) today announced a multi-generation collaboration with Amazon to enable customized silicon at scale for large-scale AI data centers, working together on AI inference. In addition, the companies are working on optical connectivity solutions extending up to 1.6T and future-generation solutions.

As AI workloads grow exponentially — driving unprecedented demand for compute, storage, networking and memory bandwidth, and energy-efficient infrastructure — the collaboration brings together Amazon's comprehensive, secure, and price-performant AI infrastructure with Qualcomm Technologies' leadership in power-efficient processing, silicon design and system-level integration.

Qualcomm Technologies and Amazon will also collaborate on high-performance optical connectivity solutions designed to support the growing scale and bandwidth demands of AI infrastructure. The collaboration will leverage Qualcomm Technologies' advanced SerDes and optical DSP technologies.

As part of the expanded collaboration, Qualcomm Technologies plans to deepen its use of AWS AI infrastructure, including Amazon Bedrock, for electronic design automation (EDA) workloads, targeting a reduction in chip design cycles.